Our company newly produce GAP series high thermal conductivity gap material is a kind of silicone rubber material with low modulus (soft) and high thermal conductivity. It is used to fill the large and irregular gap between semiconductor module and heat dissipation surface to eliminate the thermal resistance produced by air, so as to facilitate the heat transfer of heating elements. The thermal conductive gap material has good flexibility (compressibility), can fill the variable gap between multiple components and the common radiator, and will only cause very low pressure on the components. The surface of thermal conductive gasket has good viscous, which can reduce the contact thermal resistance between components and radiators to the greatest extent.